Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
authorsIacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jürgen; Fehkührer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri;
publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages2097-2104
year2021
Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
authorsInoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;
publication2021 International Conference on Electronics Packaging (ICEP)
pages9-10
year2021
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
authorsInoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric;
publicationJapanese Journal of Applied Physics
volume60
number2
pages26502
year2021
Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
authorsInoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;
publication2021 International Conference on Electronics Packaging (ICEP)
pages9月10日
year2021
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10mumathrm {m} $ pitch microbumps
authorsDerakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;
publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages1119-1124
year2021
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
authorsIacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jürgen; Fehkührer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri;
publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages2097-2104
year2021
Electrochemical Deposition of Sn-Cu Alloys for Applications in 3D Stacking in Microelectronics Industry
authorsInoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Aleksandar; Hsia, Chih-Hao; Chang, Iris; Kuttner, Elisabeth;
publicationECS Meeting Abstracts
number20
pages1235
year2020
10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
authorsDerakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas;
publication2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
pages617-622
year2020
Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
authorsInoue, Fumihiro; Podpod, Arnita; Peng, Lan; Phommahaxay, Alain; Rebibis, Kenneth June; Uedono, Akira; Beyne, Eric;
publicationJournal of Manufacturing Processes
volume58
pages811-818
year2020
Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
authorsNagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric;
publicationECS Transactions
volume98
number4
pages21
year2020