業績

Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

authorsInoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;

publication2021 International Conference on Electronics Packaging (ICEP)

pages9-10

year2021

Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration

authorsInoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric;

publicationJapanese Journal of Applied Physics

volume60

number2

pages26502

year2021

Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

authorsInoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;

publication2021 International Conference on Electronics Packaging (ICEP)

pages9月10日

year2021

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10mumathrm {m} $ pitch microbumps

authorsDerakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;

publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

pages1119-1124

year2021

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

authorsIacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jürgen; Fehkührer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri;

publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

pages2097-2104

year2021

Electrochemical Deposition of Sn-Cu Alloys for Applications in 3D Stacking in Microelectronics Industry

authorsInoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Aleksandar; Hsia, Chih-Hao; Chang, Iris; Kuttner, Elisabeth;

publicationECS Meeting Abstracts

number20

pages1235

year2020

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

authorsDerakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas;

publication2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

pages617-622

year2020

Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

authorsInoue, Fumihiro; Podpod, Arnita; Peng, Lan; Phommahaxay, Alain; Rebibis, Kenneth June; Uedono, Akira; Beyne, Eric;

publicationJournal of Manufacturing Processes

volume58

pages811-818

year2020

Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding

authorsNagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric;

publicationECS Transactions

volume98

number4

pages21

year2020

Electrodeposition for Die-to-Wafer Very High-Density Interconnect

authorsInoue, Fumihiro;

publicationECS Meeting Abstracts

number25

pages1786

year2020