Application of the surface planer process to Cu pillars and wafer support tape for high‑coplanarity wafer‑level packaging
authors: Fumihiro Inoue, Alain Phommahaxay, Yohei Gokita, Berthold Möller, Eric Beyne
publication: The International Journal of Advanced Manufacturing Technology
year: 2022
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
authors: Inoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric;
publication: IEEE Electron Device Letters
volume: 42
number: 12
pages: 1826-1829
year: 2021
Electrodeposition of Indium for Low Temperature 3D Stacking
authors: Inoue, Fumihiro; Park, Kimoon; Derakhshandeh, Jaber; Yoo, Bongyoung;
publication: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
pages: 31
year: 2021
(Keynote) The unique properties of SiCN as bonding material for hybrid bonding
authors: Iacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric;
publication: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
pages: 38
year: 2021
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10um pitch microbumps
authors: Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;
publication: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages: 1119-1124
year: 2021
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
authors: Iacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jürgen; Fehkührer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri;
publication: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages: 2097-2104
year: 2021
Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
authors: Inoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;
publication: 2021 International Conference on Electronics Packaging (ICEP)
pages: 9-10
year: 2021
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
authors: Inoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric;
publication: Japanese Journal of Applied Physics
volume: 60
number: 2
pages: 26502
year: 2021
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10mumathrm {m} $ pitch microbumps
authors: Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;
publication: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages: 1119-1124
year: 2021
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
authors: Iacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jürgen; Fehkührer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri;
publication: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages: 2097-2104
year: 2021