A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10mumathrm {m} $ pitch microbumps
authorsDerakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;
publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages1119-1124
year2021