業績

Influence of composition of SiCN as interfacial layer on plasma activated direct bonding

authorsInoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald;

publicationECS Journal of Solid State Science and Technology

volume8

number6

pagesP346

year2019

Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic V th tuning and RF shielding applications

authorsVandooren, A; Wu, Z; Khaled, A; Franco, J; Parvais, B; Li, W; Witters, L; Walke, A; Peng, L; Rassoul, N;

publication2019 Symposium on VLSI Technology

pagesT56-T57

year2019

Direct bonding of low temperature heterogeneous dielectrics

authorsIacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric;

publication2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

pages2206-2212

year2019

Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding

authorsInoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Moeller, Berthold; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric;

publication2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

pages437-445

year2019

Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

authorsPhommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald;

publication2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

pages607-613

year2019

Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 um interconnect pitch scaling

authorsDerakhshandeh, J; Beyne, E; Capuz, G; Inoue, F; Cherman, V; De Preter, I; Duval, F; Slabbekoorn, J; Gerets, C; Heyvaert, C;

publication2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

pages1月6日

year2019

Protective layer for collective die to wafer hybrid bonding

authorsInoue, Fumihiro; Bertheau, Julien; Suhard, Samuel; Phommahaxay, Alain; Ohashi, Takuya; Kinoshita, Tetsuro; Kinoshita, Yohei; Beyne, Eric;

publication2019 International 3D Systems Integration Conference (3DIC)

pages1月4日

year2019

RIE dynamics for extreme wafer thinning applications

authorsRassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Inoue, Fumihiro; Piumi, Daniele; Beyer, Gerald; Miller, Andy; Beyne, Eric;

publicationMicroelectronic engineering

volume192

pages30-37

year2018

Edge Trimming Induced Defects on Direct Bonded Wafers

authorsInoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric;

publicationJournal of Electronic Packaging

volume140

number3

pages31004

year2018

Etch process modules development and integration in 3D-SOC applications

authorsTutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric;

publicationMicroelectronic Engineering

volume196

pages38-48

year2018