Electrodeposition for Die-to-Wafer Very High-Density Interconnect
authorsInoue, Fumihiro;
publicationECS Meeting Abstracts
number25
pages1786
year2020
業績
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
authorsNagano, F; Iacovo, S; Phommahaxay, A; Inoue, F; Sleeckx, E; Beyer, G; Beyne, E; Gendt, S De;
publicationECS Journal of Solid State Science and Technology
volume9
number12
pages123011
year2020
Pre-bonding Characterization of SiCN Enabled Wafer Stacking
authorsPeng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; De Vos, Joeri; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric;
publication2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
pages14-14
year2019
Defect Identification in Bonding Surface Layers by Positron Annihilation Spectroscopy
authorsInoue, Fumihiro; Peng, Lan; Iacovo, Serena; Nagano, Fuya; Sleeckx, Erik; Beyer, Gerald; Uedono, Akira; Beyne, Eric;
publication2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
pages15-15
year2019
Influence of composition of SiCN as interfacial layer on plasma activated direct bonding
authorsInoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald;
publicationECS Journal of Solid State Science and Technology
volume8
number6
pagesP346
year2019
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic V th tuning and RF shielding applications
authorsVandooren, A; Wu, Z; Khaled, A; Franco, J; Parvais, B; Li, W; Witters, L; Walke, A; Peng, L; Rassoul, N;
publication2019 Symposium on VLSI Technology
pagesT56-T57
year2019
Direct bonding of low temperature heterogeneous dielectrics
authorsIacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric;
publication2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
pages2206-2212
year2019
Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding
authorsInoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Moeller, Berthold; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric;
publication2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
pages437-445
year2019
Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems
authorsPhommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald;
publication2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
pages607-613
year2019
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 um interconnect pitch scaling
authorsDerakhshandeh, J; Beyne, E; Capuz, G; Inoue, F; Cherman, V; De Preter, I; Duval, F; Slabbekoorn, J; Gerets, C; Heyvaert, C;
publication2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
pages1月6日
year2019