Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic V th tuning and RF shielding applications
authors: Vandooren, A; Wu, Z; Khaled, A; Franco, J; Parvais, B; Li, W; Witters, L; Walke, A; Peng, L; Rassoul, N;
publication: 2019 Symposium on VLSI Technology
pages: T56-T57
year: 2019
Direct bonding of low temperature heterogeneous dielectrics
authors: Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric;
publication: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
pages: 2206-2212
year: 2019
Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding
authors: Inoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Moeller, Berthold; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric;
publication: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
pages: 437-445
year: 2019
Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems
authors: Phommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald;
publication: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
pages: 607-613
year: 2019
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 um interconnect pitch scaling
authors: Derakhshandeh, J; Beyne, E; Capuz, G; Inoue, F; Cherman, V; De Preter, I; Duval, F; Slabbekoorn, J; Gerets, C; Heyvaert, C;
publication: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
pages: 1月6日
year: 2019
Protective layer for collective die to wafer hybrid bonding
authors: Inoue, Fumihiro; Bertheau, Julien; Suhard, Samuel; Phommahaxay, Alain; Ohashi, Takuya; Kinoshita, Tetsuro; Kinoshita, Yohei; Beyne, Eric;
publication: 2019 International 3D Systems Integration Conference (3DIC)
pages: 1月4日
year: 2019
RIE dynamics for extreme wafer thinning applications
authors: Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Inoue, Fumihiro; Piumi, Daniele; Beyer, Gerald; Miller, Andy; Beyne, Eric;
publication: Microelectronic engineering
volume: 192
pages: 30-37
year: 2018
Edge Trimming Induced Defects on Direct Bonded Wafers
authors: Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric;
publication: Journal of Electronic Packaging
volume: 140
number: 3
pages: 31004
year: 2018
Etch process modules development and integration in 3D-SOC applications
authors: Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric;
publication: Microelectronic Engineering
volume: 196
pages: 38-48
year: 2018
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
authors: Vandooren, A; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Z; Walke, Amey; Deshpande, V; Rosseel, E; Hikavyy, Andriy;
publication: 2018 International Conference on IC Design & Technology (ICICDT)
pages: 145-148
year: 2018