Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
authorsNagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan;
publicationECS Journal of Solid State Science and Technology
DOI: https://doi.org/10.1149/2162-8777/ac7662
year2022
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
authorsPark, Kimoon; Inoue, Fumihiro; Derakhshandeh, Jaber; Yoo, Bongyoung
publicationJapanese Journal of Applied Physics
DOI: https://doi.org/10.35848/1347-4065/ac52ba
year2022
Application of the surface planer process to Cu pillars and wafer support tape for high‑coplanarity wafer‑level packaging
authors Fumihiro Inoue, Alain Phommahaxay, Yohei Gokita, Berthold Möller, Eric Beyne
publication The International Journal of Advanced Manufacturing Technology
year2022
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
authorsInoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric;
publicationIEEE Electron Device Letters
volume42
number12
pages1826-1829
year2021
Electrodeposition of Indium for Low Temperature 3D Stacking
authorsInoue, Fumihiro; Park, Kimoon; Derakhshandeh, Jaber; Yoo, Bongyoung;
publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
pages31
year2021
(Keynote) The unique properties of SiCN as bonding material for hybrid bonding
authorsIacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric;
publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
pages38
year2021
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10um pitch microbumps
authorsDerakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;
publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages1119-1124
year2021
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
authorsIacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jürgen; Fehkührer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri;
publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
pages2097-2104
year2021
Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
authorsInoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;
publication2021 International Conference on Electronics Packaging (ICEP)
pages9-10
year2021
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
authorsInoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric;
publicationJapanese Journal of Applied Physics
volume60
number2
pages26502
year2021