Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
authorsNagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan;
publicationECS Journal of Solid State Science and Technology
DOI: https://doi.org/10.1149/2162-8777/ac7662
year2022