Minimizing Recess of Cu Pad on Hybrid Bonding with SiCN via Non-selective Chemical Mechanical Polishing and Post-cleaning Steps
authors: Nakayama, Kohei; Hayama, Kenta; Tanaka, Fabiana Lie; La, Mai Thi Ngoc; Inoue, Fumihiro;
publication: ECS Journal of Solid State Science and Technology
year: 2024
DOI: 10.1149/2162-8777/ad5fb7