Protective layer for collective die to wafer hybrid bonding
authorsInoue, Fumihiro; Bertheau, Julien; Suhard, Samuel; Phommahaxay, Alain; Ohashi, Takuya; Kinoshita, Tetsuro; Kinoshita, Yohei; Beyne, Eric;
publication2019 International 3D Systems Integration Conference (3DIC)
pages1月4日
year2019
RIE dynamics for extreme wafer thinning applications
authorsRassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Inoue, Fumihiro; Piumi, Daniele; Beyer, Gerald; Miller, Andy; Beyne, Eric;
publicationMicroelectronic engineering
volume192
pages30-37
year2018
Edge Trimming Induced Defects on Direct Bonded Wafers
authorsInoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric;
publicationJournal of Electronic Packaging
volume140
number3
pages31004
year2018
Etch process modules development and integration in 3D-SOC applications
authorsTutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric;
publicationMicroelectronic Engineering
volume196
pages38-48
year2018
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
authorsVandooren, A; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Z; Walke, Amey; Deshpande, V; Rosseel, E; Hikavyy, Andriy;
publication2018 International Conference on IC Design & Technology (ICICDT)
pages145-148
year2018
Influence of Composition of SiCN Film for Surface Activated Bonding
authorsInoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Visker, Jakob; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy;
publicationECS Transactions
volume86
number5
pages159
year2018
Extreme thinned-wafer bonding using low temperature curable polyimide for advanced wafer level integrations
authorsBertheau, Julien; Inoue, Fumihiro; Phommahaxay, Alain; Iacovo, Serena; Rassoul, Nouredine; Sleeckx, Erik; Rebibs, Kenneth; Miller, Andy; Beyer, Gerald; Beyne, Eric;
publication2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
pages86-91
year2018
Advances in sicn-sicn bonding with high accuracy wafer-to-wafer (w2w) stacking technology
authorsPeng, L; Kim, SW; Iacovo, S; Inoue, F; Phommahaxay, A; Sleeckx, E; De Vos, J; Miller, A; Beyer, G; Beyne, E;
publication2018 IEEE International Interconnect Technology Conference (IITC)
pages179-181
year2018
3-D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
authorsVandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Z; Witters, L; Walke, A; Li, Wei; Peng, Lan; Deshpande, Veeresh; Bufler, Fabian M;
publicationIEEE Transactions on Electron Devices
volume65
number11
pages5165-5171
year2018
3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525° C with improved reliability
authorsVandooren, Anne; Franco, Jacopo; Parvais, B; Wu, Z; Witters, L; Walke, A; Li, Wei; Peng, Lan; Desphande, Veeresh; Bufler, Fabian M;
publication2018 IEEE Symposium on VLSI Technology
pages69-70
year2018