Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
authorsVandooren, A; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Z; Walke, Amey; Deshpande, V; Rosseel, E; Hikavyy, Andriy;
publication2018 International Conference on IC Design & Technology (ICICDT)
pages145-148
year2018