業績

2022年03月18日 / Last updated : 2022年08月08日

Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

authorsPark, Kimoon; Inoue, Fumihiro; Derakhshandeh, Jaber; Yoo, Bongyoung

publicationJapanese Journal of Applied Physics

DOI: https://doi.org/10.35848/1347-4065/ac52ba

year2022

2022年01月19日 / Last updated : 2022年01月19日

Application of the surface planer process to Cu pillars and wafer support tape for high‑coplanarity wafer‑level packaging

authors Fumihiro Inoue, Alain Phommahaxay, Yohei Gokita, Berthold Möller, Eric Beyne

publication The International Journal of Advanced Manufacturing Technology

DOI10.1109/LED.2021.3124960

year2022

2021年11月26日 / Last updated : 2021年11月26日

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

authorsInoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric;

publicationIEEE Electron Device Letters

volume42

number12

pages1826-1829

DOI10.1109/LED.2021.3124960

year2021

2021年11月26日 / Last updated : 2021年11月26日

Electrodeposition of Indium for Low Temperature 3D Stacking

authorsInoue, Fumihiro; Park, Kimoon; Derakhshandeh, Jaber; Yoo, Bongyoung;

publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

pages31

year2021

2021年11月26日 / Last updated : 2021年11月26日

(Keynote) The unique properties of SiCN as bonding material for hybrid bonding

authorsIacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric;

publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

pages38

year2021

2021年11月26日 / Last updated : 2021年11月26日

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10um pitch microbumps

authorsDerakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;

publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

pages1119-1124

year2021

2021年11月26日 / Last updated : 2021年11月26日

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

authorsIacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jürgen; Fehkührer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri;

publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

pages2097-2104

year2021

2021年11月26日 / Last updated : 2021年11月26日

Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

authorsInoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;

publication2021 International Conference on Electronics Packaging (ICEP)

pages9-10

year2021

2021年06月30日 / Last updated : 2021年10月07日 論文

Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration

authorsInoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric;

publicationJapanese Journal of Applied Physics

volume60

number2

pages26502

year2021

2021年06月29日 / Last updated : 2021年10月07日 論文

Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

authorsInoue, Fumihiro; Derakhshandeh, Jaber; Gerets, Carine; Beyne, Eric;

publication2021 International Conference on Electronics Packaging (ICEP)

pages9月10日

year2021