業績

2023年08月03日 / Last updated : 2024年07月26日

Inorganic temporary direct bonding for collective die to wafer hybrid bonding

authors: Inoue, Fumihiro; Teranishi, Shunsuke; Iwata, Tomoya; Onishi, Koki; Yamamoto, Naoko; Kawai, Akihito; Aoki, Shimpei; Hare, Takashi; Uedono, Akira;

publication: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

Pages:556-563

Year: 2023

Publisher: IEEE

DOI: 10.1109/ECTC51909.2023.00099

2023年03月02日 / Last updated : 2024年07月26日

Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance

authors: Nagano, F; Inoue, F; Phommahaxay, A; Peng, L; Chancerel, F; Naser, H; Beyer, G; Uedono, A; Beyne, E; De Gendt, S;

publication: ECS Journal of Solid State Science and Technology

Volume: 12

Number: 3

Pages: 33002

Year: 2023

Publisher: IOP Publishing

DOI: 10.1149/2162-8777/acbe18

2023年01月01日 / Last updated : 2024年07月26日

ウエハ薄化技術

authors: 井上史大

publication: エレクトロニクス実装学会

Volume: 26

Number: 1

Pages: 172-177

Year: 2023

Publisher: 一般社団法人エレクトロニクス実装学会

DOI: https://doi.org/10.5104/jiep.26.172

2022年06月22日 / Last updated : 2022年06月22日

Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding

authorsNagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan;

publicationECS Journal of Solid State Science and Technology

DOI: https://doi.org/10.1149/2162-8777/ac7662

year2022

2022年03月18日 / Last updated : 2022年08月08日

Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

authorsPark, Kimoon; Inoue, Fumihiro; Derakhshandeh, Jaber; Yoo, Bongyoung

publicationJapanese Journal of Applied Physics

DOI: https://doi.org/10.35848/1347-4065/ac52ba

year2022

2022年01月19日 / Last updated : 2022年01月19日

Application of the surface planer process to Cu pillars and wafer support tape for high‑coplanarity wafer‑level packaging

authors Fumihiro Inoue, Alain Phommahaxay, Yohei Gokita, Berthold Möller, Eric Beyne

publication The International Journal of Advanced Manufacturing Technology

DOI10.1109/LED.2021.3124960

year2022

2021年11月26日 / Last updated : 2021年11月26日

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

authorsInoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric;

publicationIEEE Electron Device Letters

volume42

number12

pages1826-1829

DOI10.1109/LED.2021.3124960

year2021

2021年11月26日 / Last updated : 2021年11月26日

Electrodeposition of Indium for Low Temperature 3D Stacking

authorsInoue, Fumihiro; Park, Kimoon; Derakhshandeh, Jaber; Yoo, Bongyoung;

publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

pages31

year2021

2021年11月26日 / Last updated : 2021年11月26日

(Keynote) The unique properties of SiCN as bonding material for hybrid bonding

authorsIacovo, Serena; Kim, Soon-Wook; Nagano, Fuya; Peng, Lan; Inoue, Fumihiro; Phommahaxay, Alain; Beyne, Eric;

publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

pages38

year2021

2021年11月26日 / Last updated : 2021年11月26日

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10um pitch microbumps

authorsDerakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas;

publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

pages1119-1124

year2021