Advanced 3D Heterogeneous devices enabled by atomic scale
planarization and direct bonding
Yokohama National University
Faculty of Engineering, Division of Systems Research
Surface Modification Laboratory

Research topicProcesses for 3D integration and advenced packaging

Hybrid bonding
Plasma activated direct bonding
Chemical mechanical polishing
Electro/Electroless deposition
Area selective deposition
Dicing

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Research topic

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