An article introducing a new method for measuring bond strength in Die to Wafer has been published. Please take a look.

  We are currently recruiting technical assistants for the laboratory. Please check the details at the following link. https://www.ynu.ac.jp/hus/engk/31164/detail.html Feel free to contact Professor Inoue with any questions or applications! Fumihiro Inoue

A student in our lab received the “Student Award” at the world’s largest international conference on CMP! In the Inoue laboratory, even master’s and undergraduate students are encouraged to submit papers to international conferences and give presentations in English. We will continue to conduct research, presentations, and provide guidance to students that will receive recognition […]