The results of collaborative research by Yokohama National University, Disco and Toray Engineering won the ‘Award of Excellence’ in the Semiconductor of the Year 2024 semiconductor manufacturing equipment category! プレスリリース一覧 – 大学案内 – 横浜国立大学 (ynu.ac.jp)

Interview published in Nikkei Crosstech. 半導体前工程が後工程をのみ込む、ゲームチェンジに備えよ | 日経クロステック（xTECH） (nikkei.com)

Interview published in NIKKEI Tech Foresigt 最先端半導体、前工程が後工程へ進出　揺らぐ日本企業 – 日経テックフォーサイト (nikkei.com)

Inoue received Young Scientists’ Prize of the Minister of Education, Culture, Sports, Science and Technology in the field of science and technology 2024. 令和6年度科学技術分野の文部科学大臣表彰受賞者等を決定しました：文部科学省 (mext.go.jp)

New paper on a bonding film available in Reconstructed D2W and Collective D2W for next generation chiplet integration. 「Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications」 Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications | ACS Applied Electronic Materials