I spoke about what I feel every day while doing my research regarding the development of advanced packaging and chiplets! 経産省・ラピダスも注目！半導体製造”後工程”の変化と未来 | Apérza TV（アペルザTV、アペルザテレビ） | ものづくり産業向け動画サイト (aperza.com)

Recieved ‘Advanced Technology Award, Best in Class for Working People, Minister of Economy, Trade and Industry Award’.

A student from the laboratory received the ‘2024 Academic Plaza Award’ at JPCAshow2024 held at Tokyo Big Sight.  

The results of collaborative research by Yokohama National University, Disco and Toray Engineering won the ‘Award of Excellence’ in the Semiconductor of the Year 2024 semiconductor manufacturing equipment category! プレスリリース一覧 – 大学案内 – 横浜国立大学 (ynu.ac.jp)

Interview published in Nikkei Crosstech. 半導体前工程が後工程をのみ込む、ゲームチェンジに備えよ | 日経クロステック（xTECH） (nikkei.com)