[Press Release] Development of New Chip Integration Method for Semiconductor Post-Processing
A press release was issued on 30th May. Check the link below for details. https://www.ynu.ac.jp/hus/koho/30156/detail.html We have also been featured in the following newspapers/media. 電波新聞 (DEMPA DIGITAL) – 31st May 電波新聞 (DEMPA DIGITAL) – 1st June 日刊工業新聞 (NIKKAN) – 31st May TECH+(テックプラス)- 30th May EE Times – 31st May https://eetimes.itmedia.co.jp/ee/articles/2305/31/news067.html