[Press Release] Development of New Chip Integration Method for Semiconductor Post-Processing

A press release was issued on 30^th May. Check the link below for details.

https://www.ynu.ac.jp/hus/koho/30156/detail.html

We have also been featured in the following newspapers/media.

電波新聞 (DEMPA DIGITAL) – 31^st May
電波新聞 (DEMPA DIGITAL) – 1^st June
日刊工業新聞 (NIKKAN) – 31^st May
TECH+（テックプラス）- 30^th May
EE Times – 31^st May
https://eetimes.itmedia.co.jp/ee/articles/2305/31/news067.html