New paper on a bonding film available in Reconstructed D2W and Collective D2W for next generation chiplet integration. 「Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications」 Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications | ACS Applied Electronic Materials
In April, Yokohama National University established the Semiconductor and Quantum Integrated Electronics Research Center, dedicated to researching and developing “back-end” technologies that enhance semiconductor performance. The research center is composed of five laboratories and operates with a team of 18 members, including 7 professors and 11 associate professors. Professor Fumihiro Inoue serves as the Deputy […]
A third-year undergraduate student presented at the “91st Annual Conference of the Electrochemical Society of Japan” held at Nagoya University’s Higashiyama Campus. At Yokohama National University, the Route Program, which promotes early research activities among undergraduate students, is widely utilized.
“I want to revitalize Japan’s Semiconductor Industry from the back-end processes” Yokohama National University, Associate Professor speaks about 3D Integration Technology. https://www.nikkan.co.jp/articles/view/701753 https://newswitch.jp/p/40508