3D Heterogeneous Integration Alliance (3DHI)
The 3D Packaging Study Group (HIYA) and the Semiconductor 3D Packaging Materials Process Informatics Study Group (3DPI), which were launched last year, merged in April 2023 and started as the 3D Heterogeneous Integration Alliance (3DHI).
We have big dreams: to become the world’s largest semiconductor consortium in 2050!
As of December 2023, more than 60 companies are participating.
For more information, please see the link below.
2023 Management Board
Purpose of establishment, Activity content
This study group will carry out industry-government-academia collaboration activities on the theme of the formation and process of “3D hetero devices,” which are expected to be a key to revitalizing Japan’s semiconductor industry, and will aim to contribute to the semiconductor industry through collaboration between universities, public and private research organizations, and companies both in Japan and overseas who are interested.
This alliance will hold events and study groups (including seminars, etc.) at least four times a year, introducing the latest domestic and international technological trends, activities of companies and research institutions related to 3D heterogeneous integrated devices, and exchanging information and opinions between participating organizations.
3DHI Activities: Role of the Kansai-Kanto University Joint Consortium in Domestic Semiconductor Post-Processing
Source: Ministry of Economy, Trade and Industry, March 2023