“I want to revitalize Japan’s Semiconductor Industry from the back-end processes” Yokohama National University, Associate Professor speaks about 3D Integration Technology. https://www.nikkan.co.jp/articles/view/701753 https://newswitch.jp/p/40508  

An article introducing a new method for measuring bond strength in Die to Wafer has been published. Please take a look.

  We are currently recruiting technical assistants for the laboratory. Please check the details at the following link. https://www.ynu.ac.jp/hus/engk/31164/detail.html Feel free to contact Professor Inoue with any questions or applications! Fumihiro Inoue