{"id":844,"date":"2024-04-01T11:16:07","date_gmt":"2024-04-01T02:16:07","guid":{"rendered":"https:\/\/inoue.ynu.ac.jp\/?p=844"},"modified":"2024-07-25T23:44:40","modified_gmt":"2024-07-25T14:44:40","slug":"d2w%e3%83%8f%e3%82%a4%e3%83%96%e3%83%aa%e3%83%83%e3%83%89%e6%8e%a5%e5%90%88%e3%81%ae%e6%96%b0%e8%a6%8f%e9%9b%86%e7%a9%8d%e6%89%8b%e6%b3%95%e3%81%ab%e9%96%a2%e3%81%99%e3%82%8b%e8%ab%96%e6%96%87","status":"publish","type":"post","link":"https:\/\/inoue.ynu.ac.jp\/en\/2024\/04\/01\/d2w%e3%83%8f%e3%82%a4%e3%83%96%e3%83%aa%e3%83%83%e3%83%89%e6%8e%a5%e5%90%88%e3%81%ae%e6%96%b0%e8%a6%8f%e9%9b%86%e7%a9%8d%e6%89%8b%e6%b3%95%e3%81%ab%e9%96%a2%e3%81%99%e3%82%8b%e8%ab%96%e6%96%87\/","title":{"rendered":"New paper on a novel integration method for D2W Hybrid Bonding has been posted."},"content":{"rendered":"<p>New paper on a bonding film available in Reconstructed D2W and Collective D2W for next generation chiplet integration.<\/p>\n<p>\u300cTemporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications\u300d<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/pubs.acs.org\/cms\/10.1021\/acsaelm.4c00114\/asset\/images\/medium\/el4c00114_0012.gif\" \/><\/p>\n<p><a href=\"https:\/\/pubs.acs.org\/doi\/10.1021\/acsaelm.4c00114\">Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications | ACS Applied Electronic Materials<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>New paper on a bonding film available in Reconstructed D2W and Collective D2W for next generation chiplet integration. \u300cTemporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications\u300d Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications | ACS Applied Electronic Materials<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"sns_share_botton_hide":"","vkExUnit_sns_title":"","_veu_custom_css":"","veu_display_promotion_alert":"","footnotes":""},"categories":[3],"tags":[],"class_list":["post-844","post","type-post","status-publish","format-standard","hentry","category-news"],"veu_head_title_object":{"title":"","add_site_title":""},"_links":{"self":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/844","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/comments?post=844"}],"version-history":[{"count":8,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/844\/revisions"}],"predecessor-version":[{"id":901,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/844\/revisions\/901"}],"wp:attachment":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/media?parent=844"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/categories?post=844"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/tags?post=844"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}