{"id":844,"date":"2024-04-01T11:16:07","date_gmt":"2024-04-01T02:16:07","guid":{"rendered":"https:\/\/inoue.ynu.ac.jp\/?p=844"},"modified":"2024-07-25T23:44:40","modified_gmt":"2024-07-25T14:44:40","slug":"d2w%e3%83%8f%e3%82%a4%e3%83%96%e3%83%aa%e3%83%83%e3%83%89%e6%8e%a5%e5%90%88%e3%81%ae%e6%96%b0%e8%a6%8f%e9%9b%86%e7%a9%8d%e6%89%8b%e6%b3%95%e3%81%ab%e9%96%a2%e3%81%99%e3%82%8b%e8%ab%96%e6%96%87","status":"publish","type":"post","link":"https:\/\/inoue.ynu.ac.jp\/en\/2024\/04\/01\/d2w%e3%83%8f%e3%82%a4%e3%83%96%e3%83%aa%e3%83%83%e3%83%89%e6%8e%a5%e5%90%88%e3%81%ae%e6%96%b0%e8%a6%8f%e9%9b%86%e7%a9%8d%e6%89%8b%e6%b3%95%e3%81%ab%e9%96%a2%e3%81%99%e3%82%8b%e8%ab%96%e6%96%87\/","title":{"rendered":"New paper on a novel integration method for D2W Hybrid Bonding has been posted."},"content":{"rendered":"<p>New paper on a bonding film available in Reconstructed D2W and Collective D2W for next generation chiplet integration.<\/p>\n<p>\u300cTemporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications\u300d<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/pubs.acs.org\/cms\/10.1021\/acsaelm.4c00114\/asset\/images\/medium\/el4c00114_0012.gif\" \/><\/p>\n<p><a href=\"https:\/\/pubs.acs.org\/doi\/10.1021\/acsaelm.4c00114\">Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications | ACS Applied Electronic Materials<\/a><\/p><div class=\"veu_socialSet veu_socialSet-position-after veu_contentAddSection\"><script>window.twttr=(function(d,s,id){var js,fjs=d.getElementsByTagName(s)[0],t=window.twttr||{};if(d.getElementById(id))return t;js=d.createElement(s);js.id=id;js.src=\"https:\/\/platform.twitter.com\/widgets.js\";fjs.parentNode.insertBefore(js,fjs);t._e=[];t.ready=function(f){t._e.push(f);};return t;}(document,\"script\",\"twitter-wjs\"));<\/script><ul><li class=\"sb_x_twitter sb_icon\"><a class=\"sb_icon_inner\" href=\"\/\/twitter.com\/intent\/tweet?url=https%3A%2F%2Finoue.ynu.ac.jp%2Fen%2F2024%2F04%2F01%2Fd2w%25e3%2583%258f%25e3%2582%25a4%25e3%2583%2596%25e3%2583%25aa%25e3%2583%2583%25e3%2583%2589%25e6%258e%25a5%25e5%2590%2588%25e3%2581%25ae%25e6%2596%25b0%25e8%25a6%258f%25e9%259b%2586%25e7%25a9%258d%25e6%2589%258b%25e6%25b3%2595%25e3%2581%25ab%25e9%2596%25a2%25e3%2581%2599%25e3%2582%258b%25e8%25ab%2596%25e6%2596%2587%2F&amp;text=Yokohama%20National%20University%20Faculty%20of%20Engineering%2C%20Division%20of%20Systems%20Research%20Surface%20Modification%20Laboratory\" target=\"_blank\" ><span class=\"vk_icon_w_r_sns_x_twitter icon_sns\"><\/span><span class=\"sns_txt\">X<\/span><\/a><\/li><\/ul><\/div><!-- [ \/.socialSet ] -->","protected":false},"excerpt":{"rendered":"<p>New paper on a bonding film available in Reconstructed D2W and Collective D2W for next generation chiplet integration. \u300cTemporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications\u300d Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications | ACS Applied Electronic Materials<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[3],"tags":[],"class_list":["post-844","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/844","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/comments?post=844"}],"version-history":[{"count":8,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/844\/revisions"}],"predecessor-version":[{"id":901,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/844\/revisions\/901"}],"wp:attachment":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/media?parent=844"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/categories?post=844"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/tags?post=844"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}