{"id":775,"date":"2024-02-07T14:51:06","date_gmt":"2024-02-07T05:51:06","guid":{"rendered":"https:\/\/inoue.ynu.ac.jp\/?p=775"},"modified":"2024-02-09T10:04:02","modified_gmt":"2024-02-09T01:04:02","slug":"chip-scale-review%e3%81%ab%e4%ba%95%e4%b8%8a%e7%a0%94%e7%a9%b6%e5%ae%a4%e3%81%ae%e7%a0%94%e7%a9%b6%e6%88%90%e6%9e%9c%e3%81%8c%e6%8e%b2%e8%bc%89%e3%81%95%e3%82%8c%e3%81%be%e3%81%97%e3%81%9f","status":"publish","type":"post","link":"https:\/\/inoue.ynu.ac.jp\/en\/2024\/02\/07\/chip-scale-review%e3%81%ab%e4%ba%95%e4%b8%8a%e7%a0%94%e7%a9%b6%e5%ae%a4%e3%81%ae%e7%a0%94%e7%a9%b6%e6%88%90%e6%9e%9c%e3%81%8c%e6%8e%b2%e8%bc%89%e3%81%95%e3%82%8c%e3%81%be%e3%81%97%e3%81%9f\/","title":{"rendered":"Research achievements of Inoue Laboratory have been published in Chip Scale Review"},"content":{"rendered":"<p><\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"7VOzVKQOCi\"><p><a href=\"https:\/\/chipscalereview.com\/2024-issues-2\/\">2024 Issues<\/a><\/p><\/blockquote>\n<p><iframe loading=\"lazy\" class=\"wp-embedded-content\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; clip: rect(1px, 1px, 1px, 1px);\" title=\"&#8220;2024 Issues&#8221; &#8212; Chip Scale Review\" src=\"https:\/\/chipscalereview.com\/2024-issues-2\/embed\/#?secret=6uiiudkKeh#?secret=7VOzVKQOCi\" data-secret=\"7VOzVKQOCi\" width=\"600\" height=\"338\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\"><\/iframe><\/p>\n<p>An article introducing a new method for measuring bond strength in Die to Wafer has been published. Please take a look.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-776\" src=\"https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/02\/\u30b9\u30af\u30ea\u30fc\u30f3\u30b7\u30e7\u30c3\u30c8-2024-02-07-144903.png\" alt=\"\" width=\"672\" height=\"900\" srcset=\"https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/02\/\u30b9\u30af\u30ea\u30fc\u30f3\u30b7\u30e7\u30c3\u30c8-2024-02-07-144903.png 672w, https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/02\/\u30b9\u30af\u30ea\u30fc\u30f3\u30b7\u30e7\u30c3\u30c8-2024-02-07-144903-224x300.png 224w\" sizes=\"auto, (max-width: 672px) 100vw, 672px\" \/><\/p><div class=\"veu_socialSet veu_socialSet-position-after veu_contentAddSection\"><script>window.twttr=(function(d,s,id){var js,fjs=d.getElementsByTagName(s)[0],t=window.twttr||{};if(d.getElementById(id))return t;js=d.createElement(s);js.id=id;js.src=\"https:\/\/platform.twitter.com\/widgets.js\";fjs.parentNode.insertBefore(js,fjs);t._e=[];t.ready=function(f){t._e.push(f);};return t;}(document,\"script\",\"twitter-wjs\"));<\/script><ul><li class=\"sb_x_twitter sb_icon\"><a class=\"sb_icon_inner\" href=\"\/\/twitter.com\/intent\/tweet?url=https%3A%2F%2Finoue.ynu.ac.jp%2Fen%2F2024%2F02%2F07%2Fchip-scale-review%25e3%2581%25ab%25e4%25ba%2595%25e4%25b8%258a%25e7%25a0%2594%25e7%25a9%25b6%25e5%25ae%25a4%25e3%2581%25ae%25e7%25a0%2594%25e7%25a9%25b6%25e6%2588%2590%25e6%259e%259c%25e3%2581%258c%25e6%258e%25b2%25e8%25bc%2589%25e3%2581%2595%25e3%2582%258c%25e3%2581%25be%25e3%2581%2597%25e3%2581%259f%2F&amp;text=Yokohama%20National%20University%20Faculty%20of%20Engineering%2C%20Division%20of%20Systems%20Research%20Surface%20Modification%20Laboratory\" target=\"_blank\" ><span class=\"vk_icon_w_r_sns_x_twitter icon_sns\"><\/span><span class=\"sns_txt\">X<\/span><\/a><\/li><\/ul><\/div><!-- [ \/.socialSet ] -->","protected":false},"excerpt":{"rendered":"<p>An article introducing a new method for measuring bond strength in Die to Wafer has been published. Please take a look.<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[3],"tags":[],"class_list":["post-775","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/775","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/comments?post=775"}],"version-history":[{"count":2,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/775\/revisions"}],"predecessor-version":[{"id":783,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/775\/revisions\/783"}],"wp:attachment":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/media?parent=775"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/categories?post=775"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/tags?post=775"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}