{"id":775,"date":"2024-02-07T14:51:06","date_gmt":"2024-02-07T05:51:06","guid":{"rendered":"https:\/\/inoue.ynu.ac.jp\/?p=775"},"modified":"2024-02-09T10:04:02","modified_gmt":"2024-02-09T01:04:02","slug":"chip-scale-review%e3%81%ab%e4%ba%95%e4%b8%8a%e7%a0%94%e7%a9%b6%e5%ae%a4%e3%81%ae%e7%a0%94%e7%a9%b6%e6%88%90%e6%9e%9c%e3%81%8c%e6%8e%b2%e8%bc%89%e3%81%95%e3%82%8c%e3%81%be%e3%81%97%e3%81%9f","status":"publish","type":"post","link":"https:\/\/inoue.ynu.ac.jp\/en\/2024\/02\/07\/chip-scale-review%e3%81%ab%e4%ba%95%e4%b8%8a%e7%a0%94%e7%a9%b6%e5%ae%a4%e3%81%ae%e7%a0%94%e7%a9%b6%e6%88%90%e6%9e%9c%e3%81%8c%e6%8e%b2%e8%bc%89%e3%81%95%e3%82%8c%e3%81%be%e3%81%97%e3%81%9f\/","title":{"rendered":"Research achievements of Inoue Laboratory have been published in Chip Scale Review"},"content":{"rendered":"<p><\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"7VOzVKQOCi\"><p><a href=\"https:\/\/chipscalereview.com\/2024-issues-2\/\">2024 Issues<\/a><\/p><\/blockquote>\n<p><iframe loading=\"lazy\" class=\"wp-embedded-content\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; clip: rect(1px, 1px, 1px, 1px);\" title=\"&#8220;2024 Issues&#8221; &#8212; Chip Scale Review\" src=\"https:\/\/chipscalereview.com\/2024-issues-2\/embed\/#?secret=6uiiudkKeh#?secret=7VOzVKQOCi\" data-secret=\"7VOzVKQOCi\" width=\"600\" height=\"338\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\"><\/iframe><\/p>\n<p>An article introducing a new method for measuring bond strength in Die to Wafer has been published. Please take a look.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-776\" src=\"https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/02\/\u30b9\u30af\u30ea\u30fc\u30f3\u30b7\u30e7\u30c3\u30c8-2024-02-07-144903.png\" alt=\"\" width=\"672\" height=\"900\" srcset=\"https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/02\/\u30b9\u30af\u30ea\u30fc\u30f3\u30b7\u30e7\u30c3\u30c8-2024-02-07-144903.png 672w, https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/02\/\u30b9\u30af\u30ea\u30fc\u30f3\u30b7\u30e7\u30c3\u30c8-2024-02-07-144903-224x300.png 224w\" sizes=\"auto, (max-width: 672px) 100vw, 672px\" \/><\/p>","protected":false},"excerpt":{"rendered":"<p>An article introducing a new method for measuring bond strength in Die to Wafer has been published. Please take a look.<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"sns_share_botton_hide":"","vkExUnit_sns_title":"","_veu_custom_css":"","veu_display_promotion_alert":"","footnotes":""},"categories":[3],"tags":[],"class_list":["post-775","post","type-post","status-publish","format-standard","hentry","category-news"],"veu_head_title_object":{"title":"","add_site_title":""},"_links":{"self":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/775","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/comments?post=775"}],"version-history":[{"count":2,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/775\/revisions"}],"predecessor-version":[{"id":783,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/posts\/775\/revisions\/783"}],"wp:attachment":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/media?parent=775"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/categories?post=775"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/tags?post=775"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}