{"id":614,"date":"2022-08-08T11:35:36","date_gmt":"2022-08-08T02:35:36","guid":{"rendered":"https:\/\/inoue.ynu.ac.jp\/?page_id=614"},"modified":"2025-09-18T17:59:37","modified_gmt":"2025-09-18T08:59:37","slug":"3dhi","status":"publish","type":"page","link":"https:\/\/inoue.ynu.ac.jp\/en\/3dhi\/","title":{"rendered":"3DHI"},"content":{"rendered":"<p><\/p>\n<h2>3D Heterogeneous Integration Alliance (3DHI)<\/h2>\n<p>The 3D Packaging Study Group (HIYA) and the Semiconductor 3D Packaging Materials Process Informatics Study Group (3DPI), which were launched last year, merged in April 2023 and started as the 3D Heterogeneous Integration Alliance (3DHI).<\/p>\n<p>We have big dreams: to become the world&#8217;s largest semiconductor consortium in 2050!<\/p>\n<p>As of December 2023, more than 60 companies are participating.<\/p>\n<p>For more information, please see the link below.<\/p>\n<p><a href=\"https:\/\/3dhi.ynu.ac.jp\/en\/\">https:\/\/3dhi.ynu.ac.jp\/<\/a><\/p>\n<h2>2023 Management Board<\/h2>\n<table style=\"height: 80px; width: 100%; border-collapse: collapse; border-style: hidden;\">\n<tbody>\n<tr style=\"height: 39px;\">\n<td style=\"width: 22.6048%; height: 10px;\">3DHI Representative Director<\/td>\n<td style=\"width: 35.9652%; height: 10px;\">Yokohama National University (YNU)<\/td>\n<td style=\"width: 16.3397%; height: 10px;\">Associate Professor<\/td>\n<td style=\"width: 25.0903%; height: 10px;\">Inoue Fumihiro<\/td>\n<\/tr>\n<tr style=\"height: 39px;\">\n<td style=\"width: 22.6048%; height: 10px;\">Chairman<\/td>\n<td style=\"width: 35.9652%; height: 10px;\">Osaka Metropolitan University<\/td>\n<td style=\"width: 16.3397%; height: 10px;\">Professor<\/td>\n<td style=\"width: 25.0903%; height: 10px;\">Saito Takeyasu<\/td>\n<\/tr>\n<tr style=\"height: 71px;\">\n<td style=\"width: 22.6048%; height: 10px;\">Director<\/td>\n<td style=\"width: 35.9652%; height: 10px;\">Osaka Metropolitan University<\/td>\n<td style=\"width: 16.3397%; height: 10px;\">Honorary Professor<\/td>\n<td style=\"width: 25.0903%; height: 10px;\">Hirai Yoshihiko<\/td>\n<\/tr>\n<tr style=\"height: 50px;\">\n<td style=\"width: 22.6048%; height: 50px;\">Director<\/td>\n<td style=\"width: 35.9652%; height: 50px;\">Osaka Metropolitan University<\/td>\n<td style=\"width: 16.3397%; height: 50px;\">Visiting Professor<\/td>\n<td style=\"width: 25.0903%; height: 50px;\">Sasago Masaru<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h2>Purpose of establishment, Activity content<\/h2>\n<p>This study group will carry out industry-government-academia collaboration activities on the theme of the formation and process of &#8220;3D hetero devices,&#8221; which are expected to be a key to revitalizing Japan&#8217;s semiconductor industry, and will aim to contribute to the semiconductor industry through collaboration between universities, public and private research organizations, and companies both in Japan and overseas who are interested.<\/p>\n<p>This alliance will hold events and study groups (including seminars, etc.) at least four times a year, introducing the latest domestic and international technological trends, activities of companies and research institutions related to 3D heterogeneous integrated devices, and exchanging information and opinions between participating organizations.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-771\" src=\"https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/01\/3DHI\u8aac\u660e-scaled.jpg\" alt=\"\" width=\"2560\" height=\"2022\" srcset=\"https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/01\/3DHI\u8aac\u660e-scaled.jpg 2560w, https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/01\/3DHI\u8aac\u660e-300x237.jpg 300w, https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/01\/3DHI\u8aac\u660e-1024x809.jpg 1024w, https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/01\/3DHI\u8aac\u660e-768x607.jpg 768w, https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/01\/3DHI\u8aac\u660e-1536x1213.jpg 1536w, https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2024\/01\/3DHI\u8aac\u660e-2048x1618.jpg 2048w\" sizes=\"auto, (max-width: 2560px) 100vw, 2560px\" \/><\/p>\n<p>&nbsp;<\/p>\n<h2>3DHI Activities: Role of the Kansai-Kanto University Joint Consortium in Domestic Semiconductor Post-Processing<\/h2>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-679\" src=\"https:\/\/inoue.ynu.ac.jp\/wp-content\/uploads\/2023\/04\/Picture2.jpg\" alt=\"\" width=\"954\" height=\"722\" \/><\/p>\n<p>Source: Ministry of Economy, Trade and Industry, March 2023<\/p>\n<p>&nbsp;<\/p><div class=\"veu_socialSet veu_socialSet-position-after veu_contentAddSection\"><script>window.twttr=(function(d,s,id){var js,fjs=d.getElementsByTagName(s)[0],t=window.twttr||{};if(d.getElementById(id))return t;js=d.createElement(s);js.id=id;js.src=\"https:\/\/platform.twitter.com\/widgets.js\";fjs.parentNode.insertBefore(js,fjs);t._e=[];t.ready=function(f){t._e.push(f);};return t;}(document,\"script\",\"twitter-wjs\"));<\/script><ul><li class=\"sb_x_twitter sb_icon\"><a class=\"sb_icon_inner\" href=\"\/\/twitter.com\/intent\/tweet?url=https%3A%2F%2Finoue.ynu.ac.jp%2Fen%2F3dhi%2F&amp;text=Yokohama%20National%20University%20Faculty%20of%20Engineering%2C%20Division%20of%20Systems%20Research%20Surface%20Modification%20Laboratory\" target=\"_blank\" ><span class=\"vk_icon_w_r_sns_x_twitter icon_sns\"><\/span><span class=\"sns_txt\">X<\/span><\/a><\/li><\/ul><\/div><!-- [ \/.socialSet ] -->","protected":false},"excerpt":{"rendered":"<p>3D Heterogeneous Integration Alliance (3DHI) The 3D Packaging Study Group (HIYA) and the Semiconductor 3D Packaging Materials Process Informatics Study Group (3DPI), which were launched last year, merged in April 2023 and started as the 3D Heterogeneous Integration Alliance (3DHI). We have big dreams: to become the world&#8217;s largest semiconductor consortium in 2050! As of [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-614","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/pages\/614","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/comments?post=614"}],"version-history":[{"count":40,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/pages\/614\/revisions"}],"predecessor-version":[{"id":1033,"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/pages\/614\/revisions\/1033"}],"wp:attachment":[{"href":"https:\/\/inoue.ynu.ac.jp\/en\/wp-json\/wp\/v2\/media?parent=614"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}